First lustrum

This month we celebrate our first lustrum! It seems like yesterday that the 9 original founders stepped into the notary office and signed the “birth certificate” of OrangGO.

Here’s the first news item from 2014 where we announced our team to the world: Hello we are OrangGO, nice to meet you..

These first 5 years we’ve managed to establish a solid relationship with our customers and things are looking good for the near future, so on to the next lustrum!

OrangGO Swirl

After the expansion of the OrangGO main office in Zwolle, the main office door looked a bit ‘plain’, especially when compared to the old door that didn’t survive. Last week, the door, the corridor to our office and the glass window of our 2nd meeting room have been OrangGO-ed with our house style with the typical swirl and our logo.



OrangGO welcomes two new engineers

As of August 2017 OrangGO has added two new engineers (Martijn and Robert) to the team. With this addition we have  enlarged or strong team which is focused on improving semiconductor test and assembly.

Martijn and Robert will be working from our newly opened office in central Netherlands, Utrecht area (Groenekan).



Martijn and Robert, welcome in our team, and we are sure you will enjoy working at OrangGO as much as we do!

Facelift Completed


The external face-lift of our office building has been completed. It has become a real eye-catcher when you drive through Zwolle!

We are very happy with the result. The building is now modernized both on the inside and outside, and is ready for the coming years.

Have a look using Google Streetview.


Team Expansion


The OrangGO team is expanded with 2 new engineers (Florian and Rudie) in the last couple of months. They both will be active as Software Engineer, and as Application Support Engineer. Both Florian and Rudie have many years of experience in the semiconductor business. With Florian we have established our first presence outside the Netherlands. Florian is representing OrangGO in Austria. Rudie will be working from our Zwolle office and has been working in the semiconductor industry for over 20 years, as a Development Engineer on high-end ATE instruments.

We would like to welcome Florian and Rudie to our team, and hope you will enjoy working with them as much as we do!


We are going for GOLD!

gold1We are pleased that our office building is currently getting an external face-lift. From the old faded red the building will get a modern shiny golden appearance.

After the main lobby area has been retrofitted with new seating and meeting areas, it is now time to update the exterior of the building. Golden plating will modernize the look of the building combined with gray tones.

The exterior plating is 75% complete at this moment and the remaining red parts are currently being painted in a nice matching gray tone.

Keep monitoring this site to see the end result in a couple of weeks…

IMG_0764 IMG_0766

OrangGO Interesting case…

OrangGO was referred to by De Haan Advocaten & Notarissen.haan

“In december 2014 startten 9 voormalige medewerkers van een gefailleerde ICT-onderneming in Zwolle een nieuw bedrijf: OrangGO. Gespecialiseerd in het ontwikkelen van geavanceerde software. Expertise en ambitie waren in ruime mate aanwezig. De complexiteit van de organisatiestructuur en de contractvorming vereiste echter specifieke en hoogwaardige juridische en fiscale kennis.

Daarvoor klopte het bedrijf aan bij De Haan Advocaten & Notarissen. In het bijzonder bij Albert Kraster, sinds 2002 als notaris aan het kantoor verbonden en gespecialiseerd in ondernemingsrecht, vennootschapsrecht en vastgoedrecht. Daarnaast heeft hij een pragmatische kijk op notarieel juridische vraagstukken en hanteert een adequate aanpak. Deze competenties kwamen uitstekend van pas bij de start van OrangGO.”

Read the full story here…


SWTW Workshop San Diego California


For PDF Solutions we have presented wafer probe touchdown optimization software (Exensio-Test – Probe Optimization) at the tutorial sessions of the South West Test Workshop.

About Semiconductor Wafer Test Workshop: Gain insights, tools and practical guidance.  Semiconductor Wafer Test Workshop is the only event that focuses on all the aspects associated with microelectronic wafer and die level testing. The conference has the perfect mixture of manufacturer and vendor presentations. It is not a sales show, nor an academic or theoretical conference. It is a probe technology forum where attendees come to learn about recent developments in the industry and exchange ideas. There is a relaxed atmosphere with a golf tournament, an Expo, social activities and plenty of time for informal discussion and networking.  Stay on the cutting edge of technology in your industry, register for this “must-attend” event of the year.

Download Presentation here…   Full program 2015 edition workshop can be found here…


OrangGO present at PUG

pugOrangGO was present at the PUG (PDF User Group Conference) in Pleasanton California.



PDF Solutions Announces Exensio-Test

PDF Solutions Announces the Release of Exensio-Test, Augmenting Its Big Data Solution For IC Manufacturing

Apr 22, 2015 – San Jose, Calif. (PDF Solutions, Inc.)



The leading provider of yield improvement technologies and services for the integrated circuit (IC) process life cycle announced today the release of Exensio-Test software for semiconductor companies. PDF Solutions is well known for its expertise in process equipment control with the Exensio Platform, comprising the Exensio-Yield and Exensio-Control modules for yield improvement as well as fault detection and classification. Based on customer feedback, PDF Solutions has now expanded the platform to address critical areas of test, packaging and assembly with its new Exensio-Test offering. This module combines technology gained through the acquisition of key semiconductor software assets from Salland Engineering entities with the Big Data capabilities of PDF’s Exensio Platform. This new module provides test floor operation, adaptive test and analysis technology that produces diagnostic and predictive information during test, assembly and packaging operations. This information is critical to optimizing customers’ test operations, productivity and yields.

Exensio-Test, now deployed and available worldwide, enables semiconductor manufacturers to improve the efficiency and quality of their testing, as well as experience these additional benefits:

  • Significantly reduced test times through the implementation of real-time adaptive test algorithms. This reduction is required for advanced products and processes with stringent PPM (parts-per-million) defectivity requirements.
  • Reduced test time through optimization of test probe setup selection and simultaneous tester/prober recipe optimization.
  • Increased test productivity and insight into test floor efficiency across a variety of subcontractor and in-house test facilities with real-time alarms and actions.
  • Linking of manufacturing data to root causes seen in wafer sort and final test, through utilization of advanced analysis, data mining and modeling features, as well as implementation of predictive alarms.
  • Co-optimization of overall equipment effectiveness (OEE), UPM, productivity and yield, when paired with PDF Solutions’ scribe CV® technologies. This enables customers to optimize adaptive test.

As part of the development of Exensio-Test, PDF Solutions acquired key semiconductor software assets from Salland Engineering entities. Salland Engineering’s solutions were successfully implemented for test, packaging and assembly management on a worldwide basis. As part of the asset purchase, PDF Solutions acquired the following products from Salland: SE Probe and related modules, Optimizer, MapWarehouse (MWH), SE Dana, Quest, Skeleton, CM-FT, CCT, SwifTest, TestScape and TestVision. PDF Solutions continues to license and support these products as acquired from Salland, and will further develop and integrate them into the Exensio-Test module. PDF Solutions has already secured multi-year license and support agreements with many of Salland’s former customers for the continued use of these products.

“We’re happy to see that PDF has acquired these assets of Salland and excited to see integration of Salland’s testing technology to round out the Exensio platform and provide a seamless link between our manufacturing data and the data we see at our subcontractors and test facilities,” said Bob Lima, Director of Assembly and Test Operations at Peregrine Semiconductor.  “We look forward to leveraging the entire Exensio platform with the Exensio-Yield and Exensio-Control modules, to optimize our chip yields and realize its direct positive impact on our profitability.”

“PDF Solutions is currently providing customers unified access to process tool-level control, yield and characterization data through our integrated FDC and YMS capabilities in Exensio,” said Said Akar, General Manager at PDF Solutions. “However, we also want to provide state-of-the art testing at the production level. Now with the Salland technology we acquired, our fabless and IDM customers can leverage this information to significantly improve their test productivity, reach higher production yields, lower PPM and achieve a faster time-to-market.”

Exensio-Test increases OEE of test cells through optimization of tester configurations, management of tester data, implementation of adaptive test algorithms, as well as other test floor management operations. This high level of testing is critical in many of today’s electronics products which have stringent PPM defectivity requirements. Exensio-Test also has advanced adaptive test capabilities and is able to simultaneously maximize OEE and UPM (units tested per hour).


The statements in this press release regarding the expected performance and capabilities of PDF Solutions products and services and the statements regarding continued adoption by customers are forward looking and are subject to events and circumstances of the future. Actual results could differ materially from those expressed in these forward-looking statements. Risks and uncertainties that could cause results to differ materially include risks associated with continued development, support, and market acceptance, and other risks set forth in PDF Solutions’ periodic public filings with the Securities and Exchange Commission, including, without limitation, its Annual Report on Form 10-K, most recently filed on March 3, 2015, for the year ended December 31, 2014, other Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q, most recently filed for the quarter ended September 30, 2014, and Current Reports on Form 8-K and amendments to such reports. The forward-looking statements made in this press release are made as of the date hereof, and PDF Solutions does not assume any obligation to update such statements or the reasons why actual results could differ materially from those projected in such statements.


PDF Solutions, Inc. (NASDAQ: PDFS) is the leading provider of yield improvement technologies and services for the IC manufacturing process life cycle. PDF Solutions offers solutions that are designed to enable clients to lower costs of IC design and manufacture, enhance time to market, and improve profitability by addressing design and manufacturing interactions from product design to initial process ramps to mature manufacturing operations. PDF Solutions’ Characterization Vehicle® (CV®) electrical test chip infrastructure provides the core modeling capabilities, and is used by more leading manufacturers than any other test chips in the industry. Proprietary Template layout patterns provide optimum area, performance, and manufacturability for designing IC products. Exensio-Yield provides world-class variability control in manufacturing by leveraging PDF Solutions’ industry-leading yield management technology and fault detection and classification (FDC) with Exensio-Control software. Exensio-Test leverages integration and analysis technology that produces diagnostic and predictive information that can be used to further optimize semiconductor yields.  Headquartered in San Jose, Calif., PDF Solutions operates worldwide with additional offices in Canada, China, France, Germany, Italy, Japan, Korea, and Taiwan. For the Company’s latest news and information, visit

Characterization Vehicle, CV, PDF Solutions, and the PDF Solutions logo are registered trademarks of PDF Solutions, Inc. or its subsidiaries. Exensio, Template and YieldAware are trademarks of PDF Solutions, Inc. or its subsidiaries.


Gregory Walker
Chief Financial Officer
Tel:  (408) 938-6457

Ken Harris
Director of Marketing
Tel:  (408) 938-6473


© 2015 PDF Solutions, Inc.  All Rights Reserved.